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NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

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NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

China NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial supplier
NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial supplier NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial supplier NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial supplier NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial supplier NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial supplier

Large Image :  NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

Product Details:

Place of Origin: Taiwan
Brand Name: NXP
Certification: CE,ROHS
Model Number: LPC1114FHN33/302:5

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 1$/pcs~1.2$/pcs
Packaging Details: 260pcs/tray
Delivery Time: 2-4 working days after receiving the payment
Payment Terms: T/T, Western Union,paypal
Supply Ability: 10kpcs/month
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Detailed Product Description
Product Name: MCU Flash Standard Package: 260pcs/tray
Core Size: 32-bit Program Memory Size: 32KB (32K X 8)
Program Memory Type: Flash Number Of I/O: 28

NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

 

 

Description:

• System:

– ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.

– ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).

– Serial Wire Debug.

– System tick timer.

 

• Memory:

– On-chip flash programming memory for LPC1100, LPC1100L, and LPC1100C

series: 32 kB (LPC1114/LPC11C14), 24 kB (LPC1113), 16 kB

(LPC1112/LPC11C12), or 8 kB (LPC1111), 4kB (LPC1110).

– On-chip flash programming memory for LPC1100XL series: 8 kB (LPC1111), 16 kB

(LPC1112), 24 kB (LPC1113), 32 kB (LPC1114/203/303), 48 kB (LPC1114/323),

56 kB (LPC1114/333), 64 kB (LPC1115).

– 8 kB, 4 kB, 2 kB, or 1 kB SRAM.

– In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

bootloader software.

– LPC1100XL series only: page erase IAP command.

 

• Digital peripherals:

– Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down

resistors. Number of GPIO pins is reduced for smaller packages and

LPC11C22/C24.

– GPIO pins can be used as edge and level sensitive interrupt sources.

– High-current output driver (20 mA) on one pin.

– High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.

– Four general purpose timers/counters with a total of four capture inputs and up to

13 match outputs.

– Programmable WatchDog Timer (WDT).

 

• Analog peripherals:

– 10-bit ADC with input multiplexing among up to 8 pins.

 

• Serial interfaces:

– UART with fractional baud rate generation, internal FIFO, and RS-485 support.

– Two SPI controllers with SSP features and with FIFO and multi-protocol

capabilities (second SPI on LQFP48 packages only).

– I

2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a

data rate of 1 Mbit/s with multiple address recognition and monitor mode.

– C_CAN controller (LPC11Cxx only). On-chip CAN and CANopen drivers included.

– On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only).

 

• Clock generation:

– 12 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used

as a system clock.

– Crystal oscillator with an operating range of 1 MHz to 25 MHz.UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.

User manual Rev. 12.3 — 10 June 2014 7 of 547

NXP Semiconductors UM10398

Chapter 1: LPC111x/LPC11Cxx Introductory information

– Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.

– PLL allows CPU operation up to the maximum CPU rate without the need for a

high-frequency crystal. May be run from the system oscillator or the internal RC

oscillator.

– Clock output function with divider that can reflect the system oscillator clock, IRC

clock, CPU clock, and the Watchdog clock.

 

• Power control:

– Integrated PMU (Power Management Unit) to minimize power consumption during

Sleep, Deep-sleep, and Deep power-down modes.

– Power profiles residing in boot ROM allowing to optimize performance and

minimize power consumption for any given application through one simple function

call. (On LPC1100L and LPC1100XL parts only).

– Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.

– Processor wake-up from Deep-sleep mode via a dedicated start logic using up to

13 of the functional pins.

– Power-On Reset (POR).

– Brownout detect with up to four separate thresholds for interrupt and forced reset.

 

• Unique device serial number for identification.

• Single 3.3 V power supply (1.8 V to 3.6 V).

• Available as LQFP48 package, HVQFN33 package.

• LPC1100L series also available as HVQFN24, TSSOP28 package, DIP28 package,

TSSOP20 package, and SO20 package.

• Available as dual-chip module consisting of the LPC1114 single-chip microcontroller

combined with a PCF8576D Universal LCD driver in a 100-pin LQFP package (part

LPC11D14FBD100/302).1

 

 

Specification:

Standard  package

260pcs/tray

Category

Integrated Circuits (ICs)

Family

Embedded - Microcontrollers

Series

LPC1100L

Packaging  

Tray  

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

28

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

1.8 V ~ 3.6 V

Data Converters

A/D 8x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C

Package / Case

32-VQFN Exposed Pad

Supplier Device Package

32-HVQFN (7x7)

 

 

Ordering Information:

Type number

Package

Description

Version

SO20, TSSOP20, TSSOP28, and DIP28 packages

 

LPC1110FD20  

SO20

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

LPC1111FDH20/002 

TSSOP20

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

LPC1112FD20/102  

SO20

SO20: plastic small outline package; 20 leads; body width 7.5 mm width 4.4 mm

SOT163-1

LPC1112FDH20/102 

TSSOP20

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

LPC1112FDH28/102 

TSSOP28

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

SOT361-1

LPC1114FDH28/102

TSSOP28

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

SOT361-1

LPC1114FN28/102  

DIP28

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

HVQFN24/33, LQFP48, and TFBGA48 packages

 

LPC1111FHN33/101  

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/102

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111JHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/101

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/102

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN24/202

HVQFN24

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm

SOT616-3

LPC1112FHI33/102

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112FHI33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112FHI33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112JHI33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112FHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112JHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/301

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113JHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/301

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHI33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHI33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1114JHI33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1114FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114JHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/333

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114JHN33/333

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FBD48/301

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1113FBD48/302

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1113FBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1113JBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/301

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/302

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114JBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/323

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114JBD48/323

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/333

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114JBD48/333

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1115FBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1115JBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1115FET48/303 

TFBGA48

plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm

SOT1155-2

LPC1115JET48/303

TFBGA48

plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm

SOT1155-2

 

 

Application:

it is used for a Wide range of fields :

Industrial products, communication  etc

 

Product show:

NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

 

 

 

NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

 

 

 

 

 

NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial


Our advantage :

  • High quality products --- our offers are 100% new and original, ROHS
  • Competitive  price --- good Purchase channels with good price.
  • Professional service --- strict quality testing before the shipment, and perfect after-sales service after the purchase.
  • Adequate  inventory --- With the support of our strong Purchasing team,
  • Fast delivery ---  we will ship the goods within 1-3 working days after the payment confirmed.

 

be sure to meet your need for all kinds of components.    ^_^
 

 

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