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Qualcomm MDM9215 LTE 4G Wireless Communication Module MC7330 For Japan

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Qualcomm MDM9215 LTE 4G Wireless Communication Module MC7330 For Japan

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Large Image :  Qualcomm MDM9215 LTE 4G Wireless Communication Module MC7330 For Japan

Product Details:
Place of Origin: Germany
Brand Name: Sierra wireless
Certification: CE,ROHS,
Model Number: MC7330
Payment & Shipping Terms:
Minimum Order Quantity: 10pcs
Price: 120$~125$/pcs
Packaging Details: 100pcs/tray
Delivery Time: 3-5 days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 5000pcs/month
Detailed Product Description
Chipset: Qualcomm's MDM9215 Approval: Japan
Operating Temperature:: -40°C To +85°C Size: 15cm X 10cm X 7cm
Weight: 0.03KG Supply Voltage:: 3.3 V Nominal
High Light:

Sierra Wireless Module


m2m wireless module

Qualcomm MDM9215 LTE 4G Wireless Communication Module MC7330 For Japan




The Sierra Wireless MC7330 PCI Express Mini Card is a compact, 
lightweight, wireless LTE- and UMTS-based modem.
The MC7330 provides LTE, DC-HSPA+, HSPA+, HSDPA, HSUPA, 
WCDMA, GSM, GPRS, EDGE, and GNSS connectivity for 
networking, and M2M applications over several radio frequency 
bands. The device also supports 2G / 3G roaming, subject to network 
operator provisioning.
The MC7330 will be Windows 8 Mobile Broadband Interface Model 
(MBIM) compliant.


Supported RF bands

The modem, based on Qualcomm's MDM9215 baseband processor, 
supports data operation on LTE, DC-HSPA+, HSPA+, EDGE, GPRS 
and GSM networks.






Data rates


Band 1 (2100 MHz)

MIMO support

Category 3

Band 19 (850 MHz)


100 Mbps(20 MHz bandwidth)

Band 21 (1500 MHz)


50 Mbps(10 MHz bandwidth)



50 Mbps(20 MHz bandwidth)



25 Mbps(10 MHz bandwidth)


Band 1 (2100 MHz)

Diversity support

HSPA+ rates


Band 5 (850 MHz)


Up to 42 Mbps(category 24)


Band 6 (800 MHz)


Band 19 (850 MHz)


up to 5.76 Mbps(category 6)




GSM 850 ( 850 MHz)



EDGE throughput up to 236 kbps


EGSM 900 (900 MHz)


DCS 1800 (1800 MHz)


PCS 1900 (1900 MHz)


GPS: 1575.42 MHz








Application interface features

USB interface (QMI) for Windows 7 and legacy Windows operating systems
MBIM for Windows 8
USB Link Power Management (LPM2) combined with selective suspend to 
maximize power savings. Also supports fast wakeup.
AT command interface ([1] AT Command Set for User Equipment (UE) 
(Release 6) (Doc# 3GPP TS 27.007), plus proprietary extended AT 
commands in [2] AirPrime Mini Card MC73xx / MC8805 AT Command 
Reference (Doc# 4114486))
Software Development Kits (SDK) for Windows 7 and Windows 8
Linux SDK, including a Linux API (Application Program Interface)
QDL loader compliant
Support for active antenna control via dedicated antenna control signals 
Dynamic power reduction support via software and dedicated signal (DPR) 



Physical features
Small form factor—conforms to type F2 as specified in PCI 
Express Mini Card Electromechanical Specification Revision 1.2.

Operating temperature range (Class A): -30 °C to +70 °C
Operating temperature range (Class B): -40 °C to +85 °C

SIEE:15cm x 10cm x 7cm




Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB 2.0 interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks




modules application show:

Qualcomm MDM9215 LTE 4G Wireless Communication Module MC7330 For Japan 0





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