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Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0

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Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0

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Large Image :  Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0

Product Details:
Place of Origin: Germany
Certification: CE, GCF, ROHS
Model Number: MC7455
Payment & Shipping Terms:
Minimum Order Quantity: 1 pcs
Price: 125$/pcs~130$/pcs
Packaging Details: Packed in original tray firstly ,then carton, at last Bubble bag for outer packing
Delivery Time: 3-5 working days after received the payment
Payment Terms: T/T, paypal or western Union
Supply Ability: 1000pcs per month
Detailed Product Description
Product Name: LTE 4G Module Chipset: MDM 9230 Qualcomm
System: Linux And Android Temperature Range: -40℃ To 85℃
System 2: Skylight For Windows 7, 8/8.1 Applicable Market: North America, Europe
High Light:

wireless communication module


Sierra Wireless Module

Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0





Main Specifications


• FDD/TDD LTE (Cat 6)


• Carrier Aggregation

4+17, 2+17, 2+29, 4+5, 17+30, 2+13, 4+13, 4+4,

41+41, 3+20, 7+20, 3+3, 7+7

• DC-HSPA+ (42/5.76 Mbps)



Key Features

• Qualcomm MDM9230 chipset

• Single SKU for North America and Europe


• Dedicated GPS connector with GPS bias or

shared on diversity (TBD)

• GPS, Glonass, Galileo ,BeiDou

• SUPL 1.0, 2.0, XTRA2.0

• Optional support for VoLTE and CSFB voice through

future FW update

• Low power consumption

• Envelope tracking

• Software

• Gobi API, Image switching, MBIM interface

• Basic and Extended AT Commands

• Skylight for Windows 7, 8/8.1

• Linux and Android



                    Physical Characteristics


• Mini card 51 X 30 X 2.75 [mm]


• USB 3.0


• GPIOs for antenna tuning and SAR control


• PCM/I2S interface for voice (Future FW update)

                   Temperature ranges:


• –30C to +70C (operating class A)


• Storage Temperature: –40C to +85C

                   Approval & Certification




• Verizon, AT&T, Sprint, Vodafone, Others TBD



Come into Being:

The new AirPrime modules are based on the Qualcomm® Snapdragon™ X7 LTE Modem, a product of Qualcomm Technologies (QTI), a subsidiary of Qualcomm Incorporated.

LTE-Advanced is designed to improve data rates and performance on LTE networks for both network operators and their customers, As the Internet of Things continues to grow and more devices are added to cellular networks, the additional capacity and throughput that LTE-A offers is essential to providing a good user experience for a variety of mobile computing and M2M communication. We know this is a priority shared by Sierra Wireless, and we’re pleased to continue our longstanding collaboration to bring LTE-A enabled devices to consumers.

 Application and  Applicable Market:

Designed for mobile computing, networking, and industrial machine-to-machine applications, the new embedded modules are the fourth generation of LTE modules from Sierra Wireless and are offered in two form factors – the AirPrime MC Series (PCI Express Mini Card) and the EM Series (PCI Express M.2) – as well as two variants – the EM7455 and MC7455 for North American and European networks.



Samples of the new modules are available now to select customers for testing and integration. For more samples request, pls contact us any time.




module showed on the PCB:

Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0 0




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