SN74LVC2G04DCKR Dual Inverter Gate with 1.65V to 5.5V Wide Voltage 32mA Output Drive Ultra-Low Power 3.4ns Speed Tiny SC-70 Package and ESD Protection for Space-Constrained Designs

SN74LVC2G04DCKR Dual Inverter Gate with 1.65V to 5.5V Wide Voltage 32mA Output Drive Ultra-Low Power 3.4ns Speed Tiny SC-70 Package andamp; ESD Protection for Space-Constrained Designs

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Features

andbull; Available in the Texas Instruments NanoFreeandtrade; Package 1

andbull; Supports 5-V VCC Operation

andbull; Inputs Accept Voltages to 5.5 V

andbull; Maxtpd of 4.1 ns at 3.3 V

andbull; LowPower Consumption, 10-andmu;A Max ICC

andbull; andplusmn;24-mA Output Drive at 3.3 V

andbull; Typical VOLP (Output Ground Bounce) andlt;0.8 V at VCC = 3.3 V, TA = 25anddeg;C

andbull; Typical VOHV (Output VOH Undershoot) andgt;2 V at VCC = 3.3 V, TA = 25anddeg;C

andbull; Ioff Supports Partial-Power-Down Mode Operation

andbull; Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

andbull; ESDProtection Exceeds JESD 22

andndash; 2000-V Human-Body Model (A114-A)

andndash; 200-V Machine Model (A115-A)

andndash; 1000-V Charged-Device Model (C101)

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Applications

andbull; IPPhones: Wired and Wireless

andbull; Optical Modules

andbull; Optical Networking: EPON and Video Over Fiber

andbull; Point-to-Point Microwave Backhaul

andbull; Power: Telecom DC/DC Module: Analog and Digital

andbull; Private Branch Exchanges (PBX)

andbull; TETRABase Exchanges

andbull; Telecom Base Band Units

andbull; Telecom Shelters: Power Distribution Units (PDU), Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted 1 Amplifiers (TMA)

andbull; Vector Signal Analyzers and Generators

andbull; Video Converencing: IP-Based HD

andbull; WiMAXandWireless Infrastructure Equipment

andbull; Wireless Communications Testers and Wireless Repeaters

andbull; xDSLModems and DSLAM

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Description

This dual inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G04 device performs the Boolean function Y = A.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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INFORMATION

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Drawing

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