NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial
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Description:
andbull; System:
andndash; ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.
andndash; ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
andndash; Serial Wire Debug.
andndash; System tick timer.
andnbsp;
andbull; Memory:
andndash; On-chip flash programming memory for LPC1100, LPC1100L, and LPC1100C
series: 32 kB (LPC1114/LPC11C14), 24 kB (LPC1113), 16 kB
(LPC1112/LPC11C12), or 8 kB (LPC1111), 4kB (LPC1110).
andndash; On-chip flash programming memory for LPC1100XL series: 8 kB (LPC1111), 16 kB
(LPC1112), 24 kB (LPC1113), 32 kB (LPC1114/203/303), 48 kB (LPC1114/323),
56 kB (LPC1114/333), 64 kB (LPC1115).
andndash; 8 kB, 4 kB, 2 kB, or 1 kB SRAM.
andndash; In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
andndash; LPC1100XL series only: page erase IAP command.
andnbsp;
andbull; Digital peripherals:
andndash; Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors. Number of GPIO pins is reduced for smaller packages and
LPC11C22/C24.
andndash; GPIO pins can be used as edge and level sensitive interrupt sources.
andndash; High-current output driver (20 mA) on one pin.
andndash; High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
andndash; Four general purpose timers/counters with a total of four capture inputs and up to
13 match outputs.
andndash; Programmable WatchDog Timer (WDT).
andnbsp;
andbull; Analog peripherals:
andndash; 10-bit ADC with input multiplexing among up to 8 pins.
andnbsp;
andbull; Serial interfaces:
andndash; UART with fractional baud rate generation, internal FIFO, and RS-485 support.
andndash; Two SPI controllers with SSP features and with FIFO and multi-protocol
capabilities (second SPI on LQFP48 packages only).
andndash; I
2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode.
andndash; C_CAN controller (LPC11Cxx only). On-chip CAN and CANopen drivers included.
andndash; On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only).
andnbsp;
andbull; Clock generation:
andndash; 12 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used
as a system clock.
andndash; Crystal oscillator with an operating range of 1 MHz to 25 MHz.UM10398 All information provided in this document is subject to legal disclaimers. andcopy; NXP B.V. 2014. All rights reserved.
User manual Rev. 12.3 andmdash; 10 June 2014 7 of 547
NXP Semiconductors UM10398
Chapter 1: LPC111x/LPC11Cxx Introductory information
andndash; Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.
andndash; PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
andndash; Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
andnbsp;
andbull; Power control:
andndash; Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
andndash; Power profiles residing in boot ROM allowing to optimize performance and
minimize power consumption for any given application through one simple function
call. (On LPC1100L and LPC1100XL parts only).
andndash; Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
andndash; Processor wake-up from Deep-sleep mode via a dedicated start logic using up to
13 of the functional pins.
andndash; Power-On Reset (POR).
andndash; Brownout detect with up to four separate thresholds for interrupt and forced reset.
andnbsp;
andbull; Unique device serial number for identification.
andbull; Single 3.3 V power supply (1.8 V to 3.6 V).
andbull; Available as LQFP48 package, HVQFN33 package.
andbull; LPC1100L series also available as HVQFN24, TSSOP28 package, DIP28 package,
TSSOP20 package, and SO20 package.
andbull; Available as dual-chip module consisting of the LPC1114 single-chip microcontroller
combined with a PCF8576D Universal LCD driver in a 100-pin LQFP package (part
LPC11D14FBD100/302).1
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Specification:
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Standardandnbsp; package
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260pcs/tray
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Category
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Integrated Circuits (ICs)
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Family
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Embedded - Microcontrollers
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Series
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LPC1100L
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Packagingandnbsp;andnbsp;
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Trayandnbsp;andnbsp;
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Core Processor
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ARMandreg; Cortexandreg;-M0
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Core Size
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32-Bit
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Speed
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50MHz
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Connectivity
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Iandsup2;C, SPI, UART/USART
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Peripherals
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Brown-out Detect/Reset, POR, WDT
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Number of I/O
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28
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Program Memory Size
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32KB (32K x 8)
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Program Memory Type
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FLASH
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EEPROM Size
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-
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RAM Size
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8K x 8
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Voltage - Supply (Vcc/Vdd)
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1.8 V ~ 3.6 V
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Data Converters
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A/D 8x10b
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Oscillator Type
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Internal
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Operating Temperature
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-40anddeg;C ~ 85anddeg;C
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Package / Case
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32-VQFN Exposed Pad
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Supplier Device Package
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32-HVQFN (7x7)
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Ordering Information:
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Type number
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Package
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Description
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Version
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SO20, TSSOP20, TSSOP28, and DIP28 packages
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LPC1110FD20andnbsp;andnbsp;
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SO20
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SO20: plastic small outline package; 20 leads; body width 7.5 mm
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SOT163-1
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LPC1111FDH20/002andnbsp;
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TSSOP20
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TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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SOT360-1
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LPC1112FD20/102andnbsp;andnbsp;
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SO20
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SO20: plastic small outline package; 20 leads; body width 7.5 mm width 4.4 mm
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SOT163-1
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LPC1112FDH20/102andnbsp;
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TSSOP20
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TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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SOT360-1
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LPC1112FDH28/102andnbsp;
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TSSOP28
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TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
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SOT361-1
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LPC1114FDH28/102
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TSSOP28
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TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
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SOT361-1
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LPC1114FN28/102andnbsp;andnbsp;
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DIP28
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DIP28: plastic dual in-line package; 28 leads (600 mil)
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SOT117-1
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HVQFN24/33, LQFP48, and TFBGA48 packages
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LPC1111FHN33/101andnbsp;andnbsp;
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1111FHN33/102
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1111FHN33/201
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1111FHN33/202
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1111FHN33/103
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1111JHN33/103
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1111FHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1111JHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112FHN33/101
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112FHN33/102
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112FHN33/201
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112FHN33/202
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112FHN24/202
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HVQFN24
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm
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SOT616-3
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LPC1112FHI33/102
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm
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n/a
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LPC1112FHI33/202
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm
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n/a
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LPC1112FHI33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm
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n/a
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LPC1112JHI33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm
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n/a
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LPC1112FHN33/103
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112JHN33/103
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112JHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1112FHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113FHN33/201
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113FHN33/202
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113FHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113JHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113FHN33/301
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113FHN33/302
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113FHN33/303
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113JHN33/303
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114FHN33/201
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114FHN33/202
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114FHN33/301
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114FHN33/302
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114FHI33/302
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
|
n/a
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LPC1114FHI33/303
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm
|
n/a
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LPC1114JHI33/303
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm
|
n/a
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LPC1114FHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
|
n/a
|
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LPC1114JHN33/203
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114FHN33/303
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114JHN33/303
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114FHN33/333
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1114JHN33/333
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HVQFN33
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HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm
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n/a
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LPC1113FBD48/301
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
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LPC1113FBD48/302
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
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LPC1113FBD48/303
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
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LPC1113JBD48/303
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
|
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LPC1114FBD48/301
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
|
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LPC1114FBD48/302
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
|
SOT313-2
|
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LPC1114FBD48/303
|
LQFP48
|
LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
|
SOT313-2
|
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LPC1114JBD48/303
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LQFP48
|
LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
|
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LPC1114FBD48/323
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
|
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LPC1114JBD48/323
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
|
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LPC1114FBD48/333
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
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LPC1114JBD48/333
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
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LPC1115FBD48/303
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
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SOT313-2
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LPC1115JBD48/303
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LQFP48
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LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm andacute;
|
SOT313-2
|
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LPC1115FET48/303andnbsp;
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TFBGA48
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plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm
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SOT1155-2
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LPC1115JET48/303
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TFBGA48
|
plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm
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SOT1155-2
|
andnbsp;
andnbsp;
Application:
it is used for aandnbsp;Wide range of fields :
Industrial products, communication andnbsp;etc
andnbsp;
Product show:
andnbsp;
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Our advantage :
- High quality products --- our offers are 100% new and original, ROHS
- Competitiveandnbsp; price --- good Purchase channels with good price.
- Professional service --- strict quality testing before the shipment, and perfect after-sales service after the purchase.
- Adequate andnbsp;inventory --- With the support of our strong Purchasing team,
- Fast delivery ---andnbsp; we will ship the goods within 1-3 working days after the payment confirmed.
andnbsp;
be sure to meet your need for all kinds of components.andnbsp;andnbsp;andnbsp; ^_^
andnbsp;
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Product andnbsp;List
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